KMRX10014M-B614

In-Stock: 9800	DC: 25+
Manufacturer: SAMSUNG	Lead Time: In Stock
Shipment Way: DHL/Fedex/TNT/UPS	Datasheets: KMRX10014M-B614 Datasheet
100% original and authentic 100% test report if single part is over 500USD 100% damaged replacement guaranteed

KMRX10014M-B614 Specifications

Parameter	Specification
Manufacturer	Samsung Electronics Co., Ltd.
Packaging	221-ball FBGA (11.5 × 13 × 1.2 mm)
Memory Type	eMCP Memory
Memory Format	eMMC 5.1 Storage + LPDDR3 RAM
Technology	eMMC 5.1 / LPDDR3
Memory Size	32GB (eMMC) + 4GB (DRAM)
Memory Interface	8-bit eMMC (HS200/HS400) & LPDDR3 (DQS differential)
Clock Frequency	eMMC: 0-200 MHz; LPDDR3: 933 MHz (1866 Mbps)
Voltage – Supply	VCC: 2.7~3.6V; VCCQ: 1.7~1.95V; VDD1: 1.7~1.95V
Operating Temperature	-25°C to +85°C (Commercial)
Mounting Type	Surface-mount reflow soldering
Supplier Device Package	221-FBGA, 11.5×13×1.2mm

Samsung Electronics’ KMRX10014M-B614 is an eMCP memory chip that packs 32GB eMMC 5.1 NAND flash and 4GB LPDDR3 DRAM into a compact 221-FBGA package. It powers space-constrained systems across smartphones, tablets, IoT gateways, and industrial control boards. With this part now in the End-of-Life (EOL) phase, buyers primarily seek it for aftermarket repair replacements while prioritizing strict authenticity verification to avoid counterfeit or refurbished units.

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