XCKU060-1FFVA1156C

This FPGA offers a high level of performance and integration suitable for a wide range of applications, including data center, wireless communication, aerospace, and defense. The “FFVA1156” package indicates a flip-chip fine-pitch ball grid array package with 1156 pins, providing a high-density packaging solution for complex designs. Whether in data centers, telecommunications infrastructure, aerospace systems, or industrial automation, the XCKU060-1FFVA1156C excels in delivering performance, flexibility, and reliability for demanding applications